The ACTECH^?1210/SW220D self-adhesive wave-transparent epoxy prepreg was bonded with Nomex honeycomb to prepare honeycomb sandwich structure. The adhesive strength was characterized by roller peel strength, and the influences of different curing process parameters on adhesive strength were studied. During the preparation of the honeycomb sandwich structure, the key process parameters such as the timing of pressurization, the method of assembly, and the magnitude of the applied pressure were studied. The experimental results show that the adhesive quality between ACTECH^?1210/SW220D prepreg and Nomex honeycomb is good, and the peel strength of roller can reach 57(N·mm)/mm. The assembly of upper and lower cover plates has a positive effect on the bonding strength. Compared with the assembly method using only the lower cover plate, the peel strength of the sandwich structure roller assembled with the upper and lower cover plates is increased by 98.3%. Both the autoclave forming process and the compression molding process are suitable for honeycomb bonding. For autoclave molding process, it is more suitable to press in the initial range of~65℃, and for compression molding process, it is more suitable to press in the initial range of ~100℃, and the applied pressure range can be selected from 0.3 MPa to 0.4 MPa. The comprehensive results show that the use of ACTECH^?1210/SW220D self-adhesive prepreg and honeycomb bonding can prepare a honeycomb sandwich structure with good bonding strength.